APA (7th ed.) Citation
Lau, J. H., & Lee, N. (2020). Assembly and Reliability of Lead-Free Solder Joints. Springer.
Chicago Style (17th ed.) Citation
Lau, John H., and Ning-Cheng Lee. Assembly and Reliability of Lead-Free Solder Joints. Singapore: Springer, 2020.
MLA (9th ed.) Citation
Lau, John H., and Ning-Cheng Lee. Assembly and Reliability of Lead-Free Solder Joints. Springer, 2020.
Warning: These citations may not always be 100% accurate.