Citazione Stile APA (7a Edizione)
Lee, T., & et al. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer.
Citazione stile Chigago Style (17a edizione)
Lee, Tae-Kyu, e et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. New York: Springer, 2015.
Citatione MLA (9a ed.)
Lee, Tae-Kyu, e et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer, 2015.
Attenzione: Queste citazioni potrebbero non essere precise al 100%.