APA (7th ed.) Citation
Lee, T., & et al. (2015). Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer.
Chicago Style (17th ed.) Citation
Lee, Tae-Kyu, and et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. New York: Springer, 2015.
MLA (9th ed.) Citation
Lee, Tae-Kyu, and et al. Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability. Springer, 2015.
Warning: These citations may not always be 100% accurate.