Goga, P., & Ožvold, M. (2007). Tepelné vlastnosti bezolovnatých spájok pre elektrotechniku = Thermal properties of lead free solders for electronics: Diplomová práca. STU v Bratislave MTF UMAT.
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Chicago Style (17th ed.) Citation
Goga, Peter, and Milan Ožvold. Tepelné Vlastnosti Bezolovnatých Spájok Pre Elektrotechniku = Thermal Properties of Lead Free Solders for Electronics: Diplomová Práca. Trnava: STU v Bratislave MTF UMAT, 2007.
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MLA (9th ed.) Citation
Goga, Peter, and Milan Ožvold. Tepelné Vlastnosti Bezolovnatých Spájok Pre Elektrotechniku = Thermal Properties of Lead Free Solders for Electronics: Diplomová Práca. STU v Bratislave MTF UMAT, 2007.
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Warning: These citations may not always be 100% accurate.