Sokolovič, J., & Koleňák, R. (2009). Použitie bezolovnatej spájky SA1015 v procese výroby novej digitálnej dosky = SA1015 lead-free solder alloy application to production process of new type of digital board: Diplomová práca. STU v Bratislave MTF UVTE KZv.
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Citação norma Chicago
Sokolovič, Ján, and Roman Koleňák. Použitie Bezolovnatej Spájky SA1015 V Procese Výroby Novej Digitálnej Dosky = SA1015 Lead-free Solder Alloy Application to Production Process of New Type of Digital Board: Diplomová Práca. Trnava: STU v Bratislave MTF UVTE KZv, 2009.
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Citação norma MLA
Sokolovič, Ján, and Roman Koleňák. Použitie Bezolovnatej Spájky SA1015 V Procese Výroby Novej Digitálnej Dosky = SA1015 Lead-free Solder Alloy Application to Production Process of New Type of Digital Board: Diplomová Práca. STU v Bratislave MTF UVTE KZv, 2009.
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