APA (7th ed.) Citation
Lee, N. (2002). Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes.
Chicago Style (17th ed.) Citation
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Boston: Newnes, 2002.
MLA (9th ed.) Citation
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes, 2002.
Warning: These citations may not always be 100% accurate.