Cita APA (7a ed.)
Lee, N. (2002). Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes.
Cita Chicago Style (17a ed.)
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Boston: Newnes, 2002.
Cita MLA (9a ed.)
Lee, Ning-Cheng. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies. Newnes, 2002.
Precaución: Estas citas no son 100% exactas.