Machajdíková, T., & Čička, R. (2023). Modeling of microstructure evolution in Sn-Ag-Cu-Ni lead-free solder system.
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Chicago Style (17th ed.) Citation
Machajdíková, Tereza, and Roman Čička. Modeling of Microstructure Evolution in Sn-Ag-Cu-Ni Lead-free Solder System. 2023.
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MLA (9th ed.) Citation
Machajdíková, Tereza, and Roman Čička. Modeling of Microstructure Evolution in Sn-Ag-Cu-Ni Lead-free Solder System. 2023.
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Warning: These citations may not always be 100% accurate.