Cita APA (7a ed.)
American Chemical Society. Division of Polymeric Materials: Science and Engineering, Kobunshi Gakkai (Japan). Polymers for Microelectronics Division, American Chemical Society. Meeting, & Reichmanis, E. (1995). Microelectronics technology: Polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995. American Chemical Society.
Cita Chicago Style (17a ed.)
American Chemical Society. Division of Polymeric Materials: Science and Engineering, Kobunshi Gakkai (Japan). Polymers for Microelectronics Division, American Chemical Society. Meeting, y Elsa Reichmanis. Microelectronics Technology: Polymers for Advanced Imaging and Packaging : Developed from a Symposium Sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995. Washington, DC: American Chemical Society, 1995.
Cita MLA (9a ed.)
American Chemical Society. Division of Polymeric Materials: Science and Engineering, et al. Microelectronics Technology: Polymers for Advanced Imaging and Packaging : Developed from a Symposium Sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995. American Chemical Society, 1995.
Precaución: Estas citas no son 100% exactas.