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| LEADER |
00000nam a22000003a 4500 |
| 001 |
stu246427 |
| 005 |
20150617230159.3 |
| 008 |
120511s2011----xxu-----------------eng-d |
| 020 |
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|a 978-0-470-41074-5
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| 040 |
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|a STU
|b slo
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| 041 |
0 |
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|a eng
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| 044 |
|
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|a xxu
|
| 080 |
|
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|a 621.7
|
| 100 |
1 |
|
|a Henshall, Gregory
|4 edt
|
| 245 |
1 |
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|a Lead-free solder process development
|
| 260 |
|
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|a Hoboken :
|b Wiley,
|c 2011
|
| 300 |
|
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|a 264 s
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| 650 |
|
7 |
|a spájkovanie
|2 stusub
|
| 650 |
|
7 |
|a bezolovnaté spájkovanie
|2 stusub
|
| 650 |
|
7 |
|a nebezpečné látky
|2 stusub
|
| 700 |
1 |
|
|a Bath, Jasbir
|4 edt
|
| 700 |
1 |
|
|a Handwerker, Carol A.
|4 edt
|
| 856 |
4 |
|
|a https://sweb.mtf.stuba.sk/obsahy/lead_free_solder_process_development_10
|u https://sweb.mtf.stuba.sk/obsahy/lead_free_solder_process_development_10
|3 OBSAH
|
| 996 |
|
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|b 284M081045
|c M*13196-1
|l MMST
|s A
|a 24
|w stu246427_0001
|