Fundamentals of Lead-Free Solder Interconnect Technology : from Microstructures to Reliability /
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| Main Author: | |
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| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
New York
Springer
2015
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| Physical Description: | 253 s. |
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| ISBN: | 978-1-4614-9265-8 |