Assembly and Reliability of Lead-Free Solder Joints /
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| Main Authors: | , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Singapore
Springer
2020
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| Subjects: | |
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MARC
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| 041 | 0 | |a eng | |
| 044 | |a si | ||
| 100 | 1 | |a Lau, John H. |4 aut | |
| 245 | 1 | 0 | |a Assembly and Reliability of Lead-Free Solder Joints / |c aut. John H Lau, Ning-Cheng Lee |
| 260 | |a Singapore |b Springer |c 2020 | ||
| 300 | |a 527 s. | ||
| 650 | 0 | 7 | |a bezolovnaté spájkovanie |
| 650 | 0 | 7 | |a bezolovnaté spájky |
| 700 | 1 | |a Lee, Ning-Cheng |4 aut | |
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