Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Enregistré dans:
| Auteur principal: | |
|---|---|
| Format: | Livre |
| Langue: | anglais |
| Publié: |
Boston :
Newnes,
2002
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| Sujets: | |
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MARC
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