Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Uložené v:
| Hlavný autor: | |
|---|---|
| Médium: | Kniha |
| Jazyk: | English |
| Vydavateľské údaje: |
Boston :
Newnes,
2002
|
| Predmet: | |
| Tagy: |
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
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MARC
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| 245 | 1 | |a Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | |
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