Vplyv tepelnej expozície na vlastnosti spájky SnAg0,3Cu0,7
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| Autore principale: | |
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| Altri autori: | |
| Natura: | Manoscritto Libro |
| Lingua: | slovacco |
| Pubblicazione: |
2017
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| Soggetti: | |
| Accesso online: | http://is.stuba.sk/zp/portal_zp.pl?podrobnosti=126986 |
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| 242 | 0 | 1 | |a The effect of thermal exposure on theproperties of SnAg0,3Cu0,7 |y eng |
| 245 | 1 | 0 | |a Vplyv tepelnej expozície na vlastnosti spájky SnAg0,3Cu0,7 |
| 260 | |c 2017 | ||
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| 650 | 4 | |a ternárne spájky |2 slo | |
| 650 | 4 | |a tepelné ovplyvnenie |2 slo | |
| 650 | 4 | |a intermetalické vrstvy |2 slo | |
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| 650 | 4 | |a binary soldering |2 eng | |
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| 650 | 4 | |a flux, thermal effect |2 eng | |
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