Tepelné vlastnosti bezolovnatých spájok pre elektrotechniku = Thermal properties of lead free solders for electronics : Diplomová práca

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Bibliographic Details
Main Author: Goga, Peter (Author)
Other Authors: Ožvold, Milan (xxx)
Format: Manuscript Book
Language:Slovak
Published: Trnava : STU v Bratislave MTF UMAT, 2007
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Description
Item Description:Program: technické materiály
Physical Description:79 s 1 CD-ROM