Štúdium vlastností spájkovaných spojov pre mikroelektroniku = Study of the soldered joint properties for microelectronics : Diplomová práca
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| Format: | Manuscript Book |
| Language: | Slovak |
| Published: |
Trnava :
STU v Bratislave MtF KZv,
2007
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| Item Description: | Program: Zváranie a spájanie materiálov |
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| Physical Description: | 64 s 1 CD-ROM |